NHanced Semiconductors recently added to its semiconductor packaging capabilities with the commissioning of an advanced packaging foundry in Odon, IN this past January. Robert Patti, president of NHanced Semiconductors, was joined by U.S. Senator Todd Young (see figure) at a recent ribbon-cutting ceremony at the new NHanced WestGate facility. Semiconductor packaging capabilities serve a wide range of markets, including commercial, industrial, medical, and military devices. The semiconductor assembly facility is part of NHanced's efforts to create a major semiconductor and microelectronics ecosystem in Indiana.
As Patti noted: “This is our first step in bringing advanced semiconductor packaging to Indiana. Our final aim, when the WestGate One complex is complete, is to deliver full Foundry 2.0 services to fulfill the needs of the U.S. Government.” Young explained: “Innovative companies like NHanced are not only providing good jobs, they are keeping us safe and secure by making technological advancements with military applications.” Regarding Indiana, Young added: “Indiana is emerging as a key player in our high-tech future, and we’re grateful for the investment NHanced is making in Hoosiers.”
The new facility is adjacent to the Naval Surface Warfare Center (NSWC) Crane, with future partnerships expected to emerge from the proximity. The NHanced Odon facility houses two cleanrooms, one for a semiconductor packaging assembly line and one planned for process development and training, for the company’s foundry in Bloomington, IN expected to open later this year. For NSWC Crane, Deputy Technical Director Dr. Kyle Werner noted: “NSWC Crane is delighted to help kick off the important semiconductor packaging work that will happen at NHanced and the WestGate One complex. Advanced semiconductor technology is central to supporting our nation’s Nuclear Triad and priority nuclear modernization efforts underway.”