Leidos
The Bayes Centre at the University of Edinburgh is a leading European hub for the advancement of AI and data science, strengthened by support from Leidos.

Leidos Partners with University of Edinburgh to Advance AI

Dec. 4, 2024
The Bayes Centre at the University of Edinburgh is a leading European hub for the advancement of AI and data science, strengthened by support from Leidos.

As part of the plan to develop artificial intelligence (AI) for defense systems and other applications, Leidos has partnered with the University of Edinburgh in the United Kingdom (UK) to advance the technology and provide its expertise in data science. Additional applications for AI include civil, environmental, healthcare, and national security areas.

Regarding the move, Charles Newhouse, CTO for Leidos UK and Europe, said, “We are excited to partner with the University of Edinburgh, a leading center for AI research in Europe. With its research excellence, interdisciplinary approach, and innovation hubs like the Bayes Centre, the university provides an ideal environment for groundbreaking advancements in AI.”

The collaboration will combine the university’s research with Leidos' Trusted Mission AI solutions in efforts to meet high-quality AI requirements for many needs. The chief AI officer at Leidos, Ron Keesing, added, “Our University Alliance Program connects Leidos with communities of innovation at top universities, and we are excited to welcome the University of Edinburgh to our global network. Universities are key partners in researching, testing, and bringing solutions to market for the nation's most challenging problems.”

The partnership enables Leidos to engage with a large talent pool of more than 45,000 students by means of internships and joint projects, to support ongoing growth at Leidos. Professor Ruth King, director of the Bayes Centre (see image above) at the University of Edinburgh, said, “We are delighted to welcome Leidos to the Bayes Centre. We are excited at this opportunity to build a collaborative partnership to advance technology and contribute to scientific development.”

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About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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