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Unify SDK Bridges Matter with Other Protocols

Feb. 28, 2023

In the Z-Wave pavilion at CES 2023, Silicon Labs showed off a Matter-over-Thread switch connected to a hub running the Unify SDK along with Z-Wave and Zigbee radios.

David Maliniak

Related To: Microwaves & RF

Check out more of our CES 2023 coverage.

As a vendor of wireless chips, Silicon Labs already supports a broad range of wireless protocols, each of which exists within their own ecosystems. At CES 2023, SiLabs set up shop in the Z-Wave booth to demonstrate how its wireless chips (in this case, the EFR32MG24 Series Multiprotocol Wireless SoC) can combine with the company's Unify software development kit (SDK) to greatly simplify IoT hub design using multiple protocols and ecosystems.

The Unify SDK makes it unnecessary for system designers to be experts in Z-Wave, Zigbee, Bluetooth LE, Wi-Fi, or, for that matter, the Matter protocol. In this video, Konrad Szupinski, senior field applications engineer at Silicon Labs, shows how Unify SDK uses the well-proven MQTT architecture in a simple API that enables Matter devices to communicate with Z-Wave devices in the home.

In this case, a Matter-over-Thread switch is connected to a hub that has Z-Wave and Zigbee radios. When the switch is turned on, the hub can turn on both a Z-Wave-enabled power outlet and a Zigbee-enabled light.

For more CES 2023 news, information, and videos, CLICK HERE.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.