Shengyi Technology
1020 Mw Shengyi Technology 77 Ptfe Laminate Promo 5f908b4a6f3aa

Ultra-Low-Loss PCB Substrate Suits 77-GHz ADAS Radar Apps

Oct. 21, 2020
PTFE material exhibits key electrical properties which mesh with the leading 77-GHz ADAS substrate of choice.

In its mmWave77 product, Shengyi Technology now offers a PTFE-based dielectric PCB laminate for which it claims the industry’s lowest transmission loss. That results in the highest transmission efficiency for mission-critical automotive safety radars. The mmWave77 laminate material exhibits excellent electrical properties with stability over frequency, temperature, and environmental changes for long-term reliability.

The material’s ceramic-filled PTFE composition exhibits homogeneous uniformity in all three directions, as well as low moisture absorption. It is made to meet the demanding electrical performance, reliability, and safety requirements of 77-GHz radars in automotive driver-assistance system (ADAS) applications. mmWave77 provides a cost-effective replacement for the mainstream PTFE laminate of choice in such scenarios.

Some key specifications include:

  • Process dielectric constant (Dk: permittivity) of 3.0 ±0.04; Df (loss tangent) is 0.0010 @ 10 GHz (stripline method); Design Dk is 3.06
  • Insertion loss: -1.29 dB/in. @ 77 GHz (based on 0.127-mm dielectric thickness, 12-mil line width, and H/H foil)
  • Dk is stable between -40° and +150℃ at up to V-band frequency. Temperature coefficient of Dk (TcDk) is between -12 and -20 ppm/° (-40°~+150°)
  • Dielectric thickness tolerance is 0.127 ±0.006 mm (5 mil ±5%)

Shengyi Technology, www.shengyi-usa.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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