Materials

Highlights

Indium Corp.
Indium Ims Promo
Critical RF and laser applications will benefit from Indium Corp.’s Au-based, precision die-attach preforms.
StratEdge
Semiconductor Package Ims2022
June 16, 2022
StratEdge’s post-fired and molded ceramic semiconductor packages meet critical needs in applications including telecom, VSAT, broadband wireless, defense, and more.
Rogers Corp.
Radix Product View
June 14, 2022
At IMS2022, Rogers Corp. will be showcasing a new 3D-printable dielectric for use in gradient dielectric-constant (GRIN) structures as well as laminates for short-range industrial...
U.S. Dept. of Defense
Deapril8 1 Promo
April 20, 2022
Additive manufacturing and 3D printing are being used with a unique concrete material to erect training barracks for the U.S. Army.
MIT Lincoln Laboratory
Deapril12 1 Promo
April 12, 2022
A custom print nozzle developed by MIT Lincoln Laboratory enables 3D printing of shielding materials directly on electronic components.
29019795 © Neil Lockhart | Dreamstime.com
Mad Scientist Dreamstime Promo
April 1, 2022
A breakthrough in materials science defies traditional electronics by doing away with them altogether in a range of audio apps.
Metasurface Ed Promo
March 31, 2022
By constructing a resonant metamaterial antenna, researchers have captured and used a meaningful amount of ambient RF energy in the low-gigahertz range of the electromagnetic ...
Wideonet | Dreamstime.com
Dreamstime M 97909730
Sometimes you want a whole meal, and sometimes just an appetizer. IMS 2021 aspires to provide the latter with short and snappy MicroApps tech presentations.
11 Myths
Today’s high-data-rate, high-frequency designs create new challenges for printed-circuit-board design.
Tilearray Promo Ed
Using a tiled array of CMOS devices, a research team devised a metasurface that provides high-speed focusing and beamforming of terahertz waves.
Ims Base Promo
Interest in components, circuit materials, and test solutions for millimeter-wave frequencies looms large as the RF/microwave industry readies for two versions of the annual IEEE...