Materials

Thermally Efficient Packages Protect ICs in Harsh Environs

June 9, 2023

StratEdge's lines of molded ceramic and post-fired ceramic semiconductor packages meet the needs of defense, satellite, automotive, and down-hole applications.

David Maliniak

Related To: Microwaves & RF

This article is part of our IMS 2023 coverage.

Visit IMS Booth 2628 for a peek at StratEdge’s thermally efficient line of post-fired and molded ceramic semiconductor packages. StratEdge offers packages that operate across the spectrum from dc to 63+ GHz, while efficiently dissipating heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). The packages enable compound semiconductor devices to meet the stringent requirements in applications such as defense, satellite, test and measurement, automotive, and down-hole.

StratEdge’s molded ceramic packages provide a suitable solution for spaceborne and defense applications. These can be manufactured with thermally enhanced metal bases to ensure efficient heat dissipation. Meanwhile, its post-fired ceramic packages feature electrical transition designs that greatly minimize signal losses.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.