Materials

Precision Au-Based Die-Attach Preforms Ensure High-Reliability Solder Joints

June 16, 2022

Critical RF and laser applications will benefit from Indium Corp.’s Au-based, precision die-attach preforms.

This article is part of our IMS2022 coverage.

Visit Indium Corporation in its IMS2022 Booth 9012, where it will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications. Au-based alloys are known for high performance and reliability in applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product.

For critical, high-reliability die-attach applications, Indium Corp.'s Au-based PDA preforms deliver features that include:

Highly accurate thickness control
Precision edge quality, virtually burr-free
Optimized cleanliness control
Default waffle-pack method

The company's AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.

AuSn preform products deliver improved wetting and voiding. They allow for adjustment of the final solder-joint composition and are available in 78Au22Sn and 79Au21Sn formulations.

For more information, visit the product webpage.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.