Panel Discusses Intel's Ohio Semiconductor Plant Plans

Jan. 26, 2022

Editors James Morra, David Maliniak, and Robert Schoenberger, along with analyst Jim Handy, discuss Intel's recent announcement of a new semiconductor plant in Ohio.

James Morra,

David Maliniak

Jim Handy

Related To: Microwaves & RF

Intel made a splash recently by announcing its intent to build a cluster of semiconductor manufacturing plants near Columbus, Ohio (Figure 1). The announcement comes in the midst of a supply-chain crisis and a critical shortage of chips, which in turn could result in a disastrous situation for the manufacture of everything from vehicles to consumer electronics to wireless infrastructure equipment.

1. Shown is an artist's rendering of Intel's proposed fab complex to be built near Columbus, Ohio.

Editors James Morra (Electronic Design), David Maliniak (Microwaves & RF), and Robert Schoenberger (Industry Week), along with Objective Analysis's Jim Handy, discuss Intel's announcement in depth. What does it mean for the current chip shortage? How important is the project to Ohio and the Midwest? How might it affect the future of chip making in the U.S.?

For further reading and viewing, visit:

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.