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Top Stories of the Week: October 21, 2024

Oct. 24, 2024
Here's some of the latest tech advancements, products, industry insights, and design solution articles.

These are some of the latest stories on Microwaves & RF. We've got the first part in a series of articles on validation of switch-mode power supplies as well as details on an AI acceleration co-processor said to offer the lowest power consumption of devices in its class.

Technology Advancements

Endeavor Business Media
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Accurate RF power amplifier characterization is critical for ensuring optimal system performance, especially at 5G frequencies, and Emerson NI’s tools simplify this process for...
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The fully digital, event-based, brain-inspired Akida Pico helps usher in compact, ultra-low-power intelligent devices.
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Imagimob enhanced its automotive machine-learning portfolio by integrating ML capabilities into Infineon's ASIL D-compliant MCUs.
Endeavor Business Media
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AI/ML-based signal detection and classification is emerging as a critical tool in gaining quick awareness of RF spectrum activity in real-time.

Products and Solutions

Empowering Smart-Home Applications with Advanced Connectivity
Smart homes are finally a reality, and they demand faster communications, increased network capacity, and solution scalability.
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Emerson NI’s PXI transceivers open a window into the future of test and measurement at sub-THz frequencies through the 5G NR FR2 band.
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A family of next-generation filters from Ranatec empowers electronics manufacturers in enhanced testing.
Lockheed Martin Corp.
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Here's this week's selection of some of the most interesting new products that have been launched of late.

Design Solutions

Analog Devices
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The article discusses key lab techniques for evaluating switch-mode power supplies (SMPS) and how to accurately measure voltage ripple and switch node using the right oscilloscope...
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Discover how artificial intelligence is revolutionizing spectrum operations, offering unparalleled speed, precision, and adaptability. AI will change the way we “see” RF.
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Explore the foundational principles behind radar technology and how these systems are engineered to meet the demanding needs of modern applications. This article sets the stage...
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Here’s a simple technique for designing and building a microwave broadband oscillator based on the venerable Gunn diode.

Industry Insights

BAE Systems
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The A4 variant of the Bradley Fighting Vehicle features modern digital electronic systems for proven situational awareness even when operating over difficult terrain and within...
L3Harris Technologies
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The compact Viper Shield EW system for F-16 jets is under full production at L3Harris Technologies in Clifton, NJ.
Endeavor Business Media
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Having established itself as an LPWAN behemoth, LoRaWAN looks toward a massive IoT future.
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Reliable cellular performance in urban environments might need an assist from reconfigurable intelligent surfaces.

Top Stories Archive

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Here's some of the latest tech advancements, products, industry insights, and design solution articles.
Rohde & Schwarz
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Here's a rundown of the latest stories of the week.
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Here's a rundown of the latest stories of the week.
Tony Vitolo | Endeavor Business Media
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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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