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IMS 2025 Coverage

June 10, 2025
Here you can find our coverage of IMS 2025 (San Francisco), the RF/microwave industry's premier annual exhibition and symposium.

The 2025 edition of the International Microwave Symposium is upon us, and it's time to take the industry's pulse while taking in its latest offerings. While you're here, look over last year's coverage and get a feel for how technologies are progressing. 

Latest IMS 2025 coverage

Q-Tech Corp.
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Q-Tech's OCXOs provide ultra-low close-in phase noise and noise floor plus reduced jitter; ideal for radar, communication, and RF measurement systems.
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The two systems-in-package enable smaller PCBs, quicken development cycles, and help simplify manufacturing.
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The devices' high output power and gain lend them to uses in longer-range data links.
Rohde & Schwarz
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Kyocera’s PAAMs can enable a wide range of 5G FR2 infrastructure installations, including site co-location of different operators running networks on different frequency bands...
Anritsu
Anritsu adds Vector Network Analyzer and Vector Voltmeter capability to Site Master field portable instruments.
Anritsu integrated vector network analyzer and vector voltmeter capability into its Site Master field portable instruments.
Mixed-Signal Devices
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This new timing portfolio delivers sub-20-fs jitter, 2-GHz performance, and rugged thermal stability, replacing analog limitations with scalable CMOS precision for AI, 5G, and...
Rohde & Schwarz
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The test and measurement leader claims the new analyzer will “overcome limitations of today’s measurement methods thanks to a novel architecture combining multiple input ports...
TagoreTech
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TagoreTech’s GaAs LNAs, GaN switches, and integrated modules deliver on performance and integration benefits.
Anritsu
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New VNA capabilities open up myriad applications in multi-band antenna test, phased-array validation, sub-6-GHz/mmWave 5G evaluations, and more.
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Nuvotronics’ StrataWorks platform opens the door to rapid design of RF filters based on the company’s PolyStrata microfabrication technology.
SV Microwave
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Connectors for VITA 67.3 embedded systems, blind-mate RF adapters, and torque-resistant edge launch connectors are among highlights.
Qorvo
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A high-efficiency power amp boosts data throughput and makes for more flexible payload architectures in power-constrained LEOs.
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The new technology is said to deliver orders-of-magnitude improvements in RF and mixed-signal performance.
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Mass production for STMicroelectronics' turnkey Bluetooth/Wi-Fi modules, developed with Qualcomm, is underway.
About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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