Photonics Modulator Reaches 60 Gb/s

April 3, 2013
By successfully creating silicon photonics modulators that use advanced modulation formats, IME and Fujikura are paving the way for future ultra-high-bandwidth long-haul telecommunications.

A recent breakthrough is promising to drive the development of next-generation long-haul telecommunications systems while making optical communications more widely accessible. Together with Fujikura Ltd., researchers from Singapore’s A*STAR Institute of Microelectronics (IME) have debuted 40- to 60-Gb/s silicon-based optical modulators. The modulators boast advanced multilevel modulation formats for high-speed, long-haul data transmission. In doing so, they bring the industry closer to attaining low-cost, ultra-high-bandwidth and small-footprint optical communications on silicon.

Each modulator consists of a set of silicon phase shifters, which are integrated in a nested Mach-Zehnder configuration. In terms of multilevel modulations, the modulators rely on simple quadrature-phase-shift-keying (QPSK) and differential-QPSK (DQPSK) formats. The result is increased information capacity, which creates more data-communication throughput for a given optical channel.

The modulators have demonstrated communication speeds of more than 40 and 60 Gb/s for DQPSK and QPSK, respectively. For channel grid spacing of 50 GHz, for example, 40G DQPSK results in a spectral efficiency that is 2X that of 20G with conventional on-off keying (OOK) format (which is widely used commercially). These new modulators are smaller than conventional lithium-niobate modulators. Being CMOS-compatible, they also are less expensive to fabricate.

About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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