• Highlights

    Texas Instruments
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    Sponsored by Texas Instruments: Space-grade plastic-packaged components serve as building blocks for low-Earth-orbit satellite payloads that perform optical, radar, and infrared...
    ETSI
    ETSI unveils a New NFV Architecture to Support Telco Cloud Networks for 6G
    April 8, 2025
    ETSI introduced a new NFV architecture that evolves the current MANO architecture toward an innovative approach around the concept of Telco Cloud.
    ID 331377626 © Pongsak Ray | Dreamstime.com
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    April 8, 2025
    As UWB wireless technology becomes more mainstream, efficient antenna design is crucial for achieving high performance at low power.
    SimCOM
    Check out the Microwaves & RF Products of the Week!
    April 6, 2025
    Here's this week's selection of some of the most interesting new products that have been launched of late.
    SIMCom
    SGP32 remote provisioning firmware is being added to all SIMCom LTE Cat 1 bis IoT modules.
    April 1, 2025
    SGP32 remote provisioning firmware, now included in all SIMCom LTE Cat 1 bis IoT modules, enables remote IoT connectivity.
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    April 1, 2025
    Majority party legislators scrambled to invigorate America’s economy with a new law they say will save the nation’s manufacturers and consumers billions of dollars in previously...
    https://stock.adobe.com/images/水を飲むキリン/979384314?prev_url=detail
    Giraffes at a metropolitan zoo drink from a trough without the distraction of the DAQ device in their enclosure.
    April 1, 2025
    Designed in conjunction with high school students for use in metropolitan zoos, a new solution offers discrete data acquisition in natural areas.

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    Direct Insight
    Direct Insight's QNX 8 BSP for QS93 i.MX93 solder-down SoM delivers low-power 64-bit solution for intelligent edge processing.
    Direct Insight's QNX 8 board support package for QS93 i.MX93 solder-down modules provides a low-power, 64-bit solution for intelligent edge processing.
    Danisense
    Danisense's current-sense transducers now offer enhanced TEDS functionality.
    Danisense’s current transducers now offer simplified plug-and-play setup and greater measurement accuracy in laboratory environments.
    ID 38359047 © Istvan2 | Dreamstime.com
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    Upgrades to Keysight’s double-pulse test systems bring easier and even higher-accuracy measurement of dynamic characteristics of bare wide-bandgap power semiconductor dies.
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    ASRock Industrial released the iEP(F)-9040 Series of high-performance edge AIoT platforms with Intel Core 200S processors.