Electro-Absorption Modulator Reaches 60 GHz

Jan. 26, 2010
PHOTONICS INNOVATIONS are behind the release of a combined modulation and photodetection transducer that can work to 60 GHz. The device, dubbed the 60G-REAM- 1550, exhibits just 3.6 dB insertion loss. It provides digital optical modulation at 50 ...

PHOTONICS INNOVATIONS are behind the release of a combined modulation and photodetection transducer that can work to 60 GHz. The device, dubbed the 60G-REAM- 1550, exhibits just 3.6 dB insertion loss. It provides digital optical modulation at 50 Gb/s and RF modulation over its bandwidth. In terms of photodetection, the transducer offers 1.0 A/W responsivity and 43 GHz bandwidth. The 60G-R-EAM-1550, designed for use with a laser diode source, operates within the 1550-nm band with a low chirp parameter. The combination of modulation and photodetection in a single device means that both up and downlinks can be duplexed over a single fiber. This reflective electro-absorption modulator strives to satisfy the need for a low-insertion-loss, low-drive-voltage optical modulator in applications like remote antennas and radio over fiber. It is especially suitable for the 28-GHz Local Multipoint Distribution Service (LMDS) band as well as experimental and research work in bands to 60 GHz. The standard package with RF connectors is suitable for use with external RF components and drivers.

Customer-specified variants can be provided on request. CIP Technologies, Phoenix House, Adastral Park, Martlesham Heath, Ipswich IP5 3RE UK; +44 (0)1473 663210, FAX: +44 (0)1473 663295, Internet: www.ciphotonics.com.

About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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