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Low-profile, low-cost antennas support the operation of many modern communication systems. Microstrip patch antennas represent one family of compact antennas that offers the benefits of a conformal nature and the capability of ready integration with a communication system's printed circuitry. By using a straightforward transmission-line model, it is possible to accurately model and analyze microstrip-line inset-fed patch antenna designs. In addition, by applying a curve-fit formula, it is possible to locate the exact inset length needed for a 50-Ω input impedance.
The feed mechanism plays an important role in the design of microstrip patch antennas. A microstrip patch antenna can be fed either by coaxial probe or by an inset microstrip line. Coaxial probe feeding is sometimes advantageous for applications like active antennas, while microstrip line feeding is suitable for developing high-gain microstrip array antennas. In both cases, the probe position or the inset length determines the input impedance.
The input impedance behavior for a coaxial probe-fed patch antenna has been studied analytically by means of various models, including the transmission-line model and the cavity model, and by means of full-wave analysis.1-3 Experimentally and theoretically, it has been found that a coaxial-probe fed-patch antenna's input impedance exhibits behavior that follows the trigonometric function:
cos20/L)>
where:
L = the length of the patch and
y0 = the position of the feed from the edge along the direction of the patch length L.
On the other hand, it has been found experimentally4 that on low-dielectric-constant materials, the input impedance of an inset-fed probe antenna exhibits fourth-order behavior following the function:
cos40/L)>
Fortunately, a simple analytical approach has been developed using the transmission-line model to find the input impedance of an inset-fed microstrip patch antenna. Using this approach, a curve-fit formula can be derived to find the inset length to achieve a 50-Ω input impedance when using modern thin dielectric circuit-board materials.