Image

Single-Layer PCB Supports Millimeter-Wave Applications

May 7, 2014
By taking advantage of the unlicensed frequency band, 60-GHz antennas can produce highly directional beam patterns. Single-layer PCB antenna arrays could provide a cost-effective and robust platform for advanced millimeter-wave applications.

The benefits of high bandwidth, narrow beam widths, and unlicensed spectrum are increasing exploration into millimeter-wave designs in the 60-GHz range. Small wavelengths at these frequencies enable large-element phased arrays in small physical areas. Yet those small wavelengths require higher tolerances and greater detail considerations during design, which often increases the cost of fabrication. To decrease a common cost factor of printed-circuit-board (PCB) design, researchers Mingjian Li, and Kwai-Man Luk from the City University of Hong Kong developed a single-layer PCB phased-array antenna. It uses reflector-backed, one-wavelength bowtie antennas combined with double-loop antennas.

A single-layer PCB antenna array has the benefit of cost and complexity reduction in design as well as a compact planar structure.

The antenna array is built upon a single-layer RT Duroid RF laminate, which is required for high-frequency transmission through the board. A 4-, 14-, and 50-element array were each fabricated and tested for maximum gain, aperture efficiency, and radiation efficiency. Compared to several antennas and arrays from literature, the proposed system performs comparably while providing stable input impedance.

The antenna arrays exhibited low cross-polarization and back-radiation levels. Enabling a low-cost platform for millimeter-wave systems may help to advance the adoption of such technologies in everyday devices. See “A Low-Profile Unidirectional Printed Antenna For Millimeter-Wave Applications,” IEEE Transaction On Antennas and Propagation, March 2014, p. 1232.

Download this article in .PDF format
This file type includes high resolution graphics and schematics when applicable.
About the Author

Jean-Jacques DeLisle

Jean-Jacques graduated from the Rochester Institute of Technology, where he completed his Master of Science in Electrical Engineering. In his studies, Jean-Jacques focused on Control Systems Design, Mixed-Signal IC Design, and RF Design. His research focus was in smart-sensor platform design for RF connector applications for the telecommunications industry. During his research, Jean-Jacques developed a passion for the field of RF/microwaves and expanded his knowledge by doing R&D for the telecommunications industry.

Sponsored Recommendations

MMIC Medium-Power Amplifier Covers 6 to 12 GHz

Nov. 11, 2024
Mini-Circuits is a global leader in the design and manufacturing of RF, IF, and microwave components from DC to 86GHz.

RF Amplifier and Filter Testing with Mini-Circuits Power Sensors

Nov. 11, 2024
RF power sensors are essential for accurately measuring RF components like filters and amplifiers, focusing on parameters such as insertion loss and gain. Employing instruments...

High-Frequency Modules to 110 GHz

Nov. 11, 2024
Mini-Circuits’ wide selection of high-frequency modules are designed, assembled and tested in-house by the best talent in the industry at our Deer Park Technology Center. The ...

Defense Technology: From Sea to Space

Oct. 31, 2024
Learn about these advancements in defense technology, including smart sensors, hypersonic weapons, and high-power microwave systems.