Sivers Semiconductors
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Sivers to Stage OTA Demos For 60-GHz Band, Among Others

June 17, 2022
Sivers will execute live, OTA demos of its products for the licensed 26-, 28-, and 39-GHz bands and the unlicensed 60-GHz band.

This article is part of our IMS2022 coverage.

Sivers Semiconductors will be in Booths 12013 and 12014 at IMS2022 to present live demonstrations covering both the licensed 26-, 28-, and 39-GHz bands and the unlicensed 60-GHz band. The company will also exhibit some successful implementations of its technology in commercial products.

Among the products to be used in over-the-air demonstrations are:

  • SUMMIT2629 and SUMMIT3741: These devices are eight-channel RF front ends for 28-GHz and 39-GHz, 5G phased-array antenna systems fabricated in RF-SOI.
  • TRB02801 and TRB03901: These 32-channel beamforming transceiver RFICs boast support for both zero-IF and IF baseband interfaces.
  • BFM02801 and BFM03901: These are a pair of active antenna modules based on the TRB RFICs.
  • 39-GHz Antenna-in Package (AiP): This demo features state-of-the art integration of the SUMMIT beamformer ICs with a unique antenna building practice.

Several demos will include configurations with partners which will be demonstrated both in Sivers Semiconductors booths as well as in the partner booths:

Airvine: Airvine recently announced the availability of their WaveTunnel, which is based on the Sivers TRXBF01 RFIC for superior performance in the 60-GHz band. It will be demonstrated live at the Sivers booth.

Kreemo: Kreemo has integrated the Sivers beamformer ICs with its innovative antennas, exemplified by the stackable antenna solutions for 360º coverage of 5G FR2 radios. This and other products will be demonstrated live at both the Kreemo and Sivers booths.

Sivers will also exhibit some successful implementations of its technology in commercial products. Examples that will be shown are CCS, Airvine, and Tachyon Networks offering a novel and cost-effective 60-GHz PmP (Point-to-MultiPoint) product, benefiting from the features enabled by Sivers' technology.

For more information, visit the company's website.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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