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Need a Reason to Attend CSICS? Here Are 2

March 23, 2017
Although IMS always gets the most attention, more focused events like CSICS provide a detailed look into specific trends and development in compound semiconductors. Papers wanted!

Why go to the 2017 Compound Semiconductor IC Symposium, held October 22-25, at Miami’s Marriott Biscayne Bay? CSICS is the premier event for networking with international colleagues on advances in all aspects of compound semis. Once associated with just gallium arsenide (GaAs), the compound conference has grown to include gallium nitride (GaN), indium phosphide (InP), silicon germanium (SiGe), graphene, diamond, and other advanced processes, including the newest adaptations of silicon CMOS. Here are two great reasons to attend:

  1. The CSICS conference provides up to date information on a wide variety of circuit applications including analog, RF, mixed-signal, millimeter-wave, terahertz circuits, and even photonics and power conversion.
  2. You can expect to attend tracks on electromagnetic and large signal modeling with the latest EDA tools. In addition, thermal analysis and advanced packaging are well represented.

Image courtesy of Thinkstock

For papers, get your abstract in by May 5th and you will hear back by mid- June on whether your paper has been accepted. The paper upload portal is just one click from the csics.org web site front page. 

For visitors, keep in mind that Miami averages a daily maximum temperature for October that’s typically between 85 and 88°F (29 to 31°C, for international attendees). Come join your international colleagues, learn about compound semis, and enjoy a nice climate! Join our 2017 IEEE CSICS LinkedIn group to stay up-to-date on CSICS happenings.

About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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