Thinkstock
DARPA

SIA Applauds DARPA’s Semiconductor Initiative

June 13, 2017
Investments by DARPA as part of the 2018 budget are expected to fuel semiconductor industry R&D.

The Semiconductor Industry Association (SIA) has welcomed a $75-million initiative expected to fund new semiconductors as part of the 2018 U.S. defense budget and funded through DARPA. The initiative would seek to drive semiconductor research beyond traditional materials and device architectures in search of new functions and performance levels.

This program would combine with DARPA’s other microelectronics R&D initiatives for a total of more than $200 million devoted to semiconductor and related technology research in the coming fiscal year. That amount would be supplemented by semiconductor industry investments.

“Semiconductors, the brains of modern electronics, are fundamental to America’s economic, technological, and military infrastructure,” said John Neuffer, president and CEO of the SIA. “Advances in semiconductor technology reverberate throughout society, making technology more affordable and accessible to consumers, and boosting U.S. innovation, productivity, and economic growth. DARPA’s new initiative would strengthen long-range semiconductor research, enhance semiconductor technology’s positive impacts on our country, and bolster national security.”

Advanced materials are expected to be a key part of the semiconductor R&D and future developments. For example, the RF/microwave industry has seen sweeping progress in many different markets due to initial government investments in gallium nitride (GaN) semiconductor materials several years ago. The ripple effect from this new DARPA investment is expected to be felt across a wide range of semiconductor applications, including communications, computing, health care, energy, and transportation.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

Sponsored Recommendations

Phase Noise Fundamentals: What You Need to Know

Dec. 26, 2024
Gain a deeper understanding of phase noise and its impact on oscillators. This white paper offers a concise technical introduction to phase noise concepts, along with an overview...

Selecting Your Next Oscilloscope: Why Fast Update Rate Matters

Dec. 26, 2024
Selecting your next oscilloscope - A guide from Rohde & Schwarz

Webinar: Fundamentals of EMI Debugging & Precompliance

Dec. 26, 2024
In this webinar our expert will guide you through the fundamentals of EMI debugging & precompliance measurements.

Learn the Fundamentals of Test and Measurement

Dec. 26, 2024
Unlock your measurement potential with Testing Fundamentals from Rohde & Schwarz. Expert resources to help you master measurement basics. Explore now.