This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.
Creating systems using the latest technology can be a challenge because it often takes advantage of the circuit board technology, high speed communication and advanced power management. Developers can become familiar with all these aspects and design a board and system or they can let someone else handle the heavy lifting by using a system-in-package (SIP).
A custom circuit board is still needed but the SIP provides a simplified interface making that board design easier. The board is often simpler with fewer layers because the SIP handles that complexity. This series examines issues, approaches and advantages of SIP technology for embedded developers.
Performing power measurements of RF devices and systems is an essential part of ensuring accurate, repeatable characterization. A variety of instruments are capable of measuring...
Mini-Circuits’ line of ceramic coaxial resonator filters features a variety of passbands and frequency ranges between 0.4 and 5.8 GHz. Characterized by high-Q and high K, these...
RF switches are ubiquitous in modern test instrumentation designs or for test & measurement applications such as those found in semiconductor test applications.
Mini-Circuits’ new PMA5-series MMIC power amplifiers afford designers both high dynamic range and significant headroom for high PAPR signals up to 10 GHz. All models provide upwards...
