This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.
Creating systems using the latest technology can be a challenge because it often takes advantage of the circuit board technology, high speed communication and advanced power management. Developers can become familiar with all these aspects and design a board and system or they can let someone else handle the heavy lifting by using a system-in-package (SIP).
A custom circuit board is still needed but the SIP provides a simplified interface making that board design easier. The board is often simpler with fewer layers because the SIP handles that complexity. This series examines issues, approaches and advantages of SIP technology for embedded developers.
From ideation to production readiness, Raytheon Advanced Technology is at the forefront of developing the systems and solutions that fuel the future of defense.
