Fotoknips and Agsandrew, Dreamstime
Agsandrew Dreamstime L 24145851 6286945b243fb 62b23287291e9

A Peek into the Future of Industrial Communications

June 21, 2022
This article provides an overview of the most promising network technologies and innovations, such as time-sensitive networking, and looks at how they’re revolutionizing industrial communications.

This article appeared in Electronic Design and has been published here with permission.

What you’ll learn:

  • How manufacturers can develop less complex and less expensive wireless communications that integrates with Wi-Fi, 5G, and single-pair Ethernet.
  • How TSN enables digital manufacturing with deterministic communications.
  • How to enhance smart-factory connectivity in the IIoT.

The world of industrial communications is moving forward faster than ever before, with breakthrough technologies quickly taking shape and providing unmatched capabilities as well as performance. These developments are helping to create flexible, responsive, and simplified networks that usher in advanced digital manufacturing activities.

Many interesting technologies have the potential to offer great opportunities for industrial and commercial uses in the information era. End users are recognizing the value of data and are keen to leverage all new devices that can act as data sources.

Today’s manufacturers are exploring the future, which means connecting the multitude of disparate devices and integrating them into a smart factory. Once the connections are made, it’s possible to leverage the power of data, which really drives the digital transformation of businesses.

More precisely, to make their production processes more agile, productive, and leaner, future-oriented companies are implementing data-driven manufacturing strategies. These rely on increasingly high-speed and reliable connections in enterprise-wide networks. The latest innovations in industrial communications are being shaped to address these precise needs with highly effective solutions.

It All Starts with TSN

A key development in industrial communications is certainly time-sensitive networking (TSN). This Open Systems Interconnection (OSI) Layer 2 technology, defined by IEEE 802.1, enhances standard Ethernet and enables digital manufacturing applications. It does so by offering consistent deterministic capabilities with low latency and jitter, even as large volumes of different kinds of data are merged into a single network.

As a result, companies can reduce the number of separate networks within their enterprises, considerably cutting cabling needs while supporting information sharing for data-driven manufacturing. The first TSN-compatible network devices are now being released to the market, enabling automation specialists and end users to create innovative applications.

Splitting the Cable

An additional interesting feature of TSN is its ability to support other new and promising industrial network technologies that are in currently being developed. One such example is single-pair Ethernet (SPE), which transmits data over a single pair of copper wires rather than four pairs. As well as transferring data, SPE also provides a simultaneous power supply to terminal devices via Power over Data Line (PoDL), enabling Power over Ethernet (PoE) capabilities.

An SPE physical layer can therefore push the benefits offered by TSN even further by deliver significant cost reductions, space savings, greater coverage, and enhanced performance. Specifically, SPE can help effectively connect an ever-increasing number of sensors, actuators, and I/O modules at the field level with higher-level enterprise systems, even at great distances, for industrial Internet of Things (IIoT) applications.

By incorporating SPE and adding power to the wire, it’s possible to add more data sources in existing facilities to monitor production activities. Right now, manufacturers find it challenging to retrofit their existing systems because of the multitude of networks they rely on. By simplifying these with a single cable that also can transfer power, businesses could reduce their installation costs while connecting many more data sources.

Going Wireless

As businesses move toward the future of industrial communications, they will need fewer cables—eventually using more wireless technologies that incorporate TSN functionalities. This will help create network architectures with unprecedented levels of flexibility while increasing data accessibility and availability to support a wide range of functionality, such as enhanced remote monitoring.

More precisely, wireless technology has prevailed for a long time and successfully been used in the IT world, in the consumer marketplace, as well as for home automation application. Now the technology is evolving to support industrial applications.

In effect, the latest 5G and 802.11 Wi-Fi standards support ultra-reliable low-latency communications (URLLC), which can be combined with TSN to provide highly accurate time synchronization. This combination enables 5G to offer communications with bounded low latency, low-delay variation, and extremely low data loss.

Jump into the Future… Now

It’s an exciting time for industrial communications, with ground-breaking technologies emerging and helping to build the connected factories of the future that generate an unprecedented level of business intelligence. In addition to the benefits provided by the individual technologies, their ability to be combined is of particular interest for automation specialists and end users. They can offer synergistic effects while also delivering solutions for continuous improvement and network migration strategies.

It’s clear to see how TSN can be integrated with the latest developments in network communications, such as SPE, 5G, and Wi-Fi. Forward-looking companies should implement TSN-compatible technologies now to reap the immediate benefits. In concert, they should futureproof their systems and prepare themselves for the next advances in industrial communications.

Businesses can now futureproof their industrial networks with TSN. It provides a high-performance gateway to support current communications needs and technologies while providing a strong and future-oriented backbone to create tomorrow’s networks.

About the Author

Thomas J. Burke | Global Strategic Advisor, CC Link Partner Association

Thomas J. Burke is Global Strategic Advisor for the CC Link Partner Association (CLPA), whose aim is to collaborate on industrial network connectivity worldwide.

In addition, Tom serves as Global Director of Industry Standards for Mitsubishi Electric to lead the strategic development and adoption of networking standards, including the adoption of Mitsubishi Electric’s open networks solutions. Tom also is the Director of Strategic Marketing for ICONICS, providing leadership to increase market share of ICONICS’ leading-edge product portfolio.

Tom’s background includes being the former OPC Foundation President & Executive Director, and he pioneered the OPC Unified Architecture (OPC UA) as the foundation of information integration and interoperability.

He has a Bachelor’s degree in theoretical mathematics from John Carroll University (Cleveland, Ohio), and a Master’s degree in computer engineering from the University of Dayton (Dayton, Ohio). 

Sponsored Recommendations

MMIC Medium-Power Amplifier Covers 6 to 12 GHz

Nov. 11, 2024
Mini-Circuits is a global leader in the design and manufacturing of RF, IF, and microwave components from DC to 86GHz.

RF Amplifier and Filter Testing with Mini-Circuits Power Sensors

Nov. 11, 2024
RF power sensors are essential for accurately measuring RF components like filters and amplifiers, focusing on parameters such as insertion loss and gain. Employing instruments...

High-Frequency Modules to 110 GHz

Nov. 11, 2024
Mini-Circuits’ wide selection of high-frequency modules are designed, assembled and tested in-house by the best talent in the industry at our Deer Park Technology Center. The ...

Defense Technology: From Sea to Space

Oct. 31, 2024
Learn about these advancements in defense technology, including smart sensors, hypersonic weapons, and high-power microwave systems.