NI Joins 6G Initiatives

July 30, 2021

David Hall, NI's director of semiconductor marketing, discusses NI's targeted business cases for 6G development in the context of the company's memberships in the Next G Alliance and NYU Wireless's Industry Affiliates program.

David Maliniak

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5G is just getting established, but 6G will be following behind. Those who fail to get moving on 6G development now eventually will find themselves in a hole. NI (formerly National Instruments) isn't sitting idly by, but rather has identified four candidate technologies within the scope of 6G. It's also buttressed itself by joining a pair of industry initiatives: the Next G Alliance and NYU Wireless's Industry Affiliates program.

In this video, NI's Director of Semiconductor Marketing, David Hall, chats with Microwaves & RF editor David Maliniak about NI's push toward 6G.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.