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Flexible Digital-I/O Instrument Bolsters PXI FPGA Lineup

Aug. 28, 2020

Replete with 56 channels of TTL logic-compatible I/O, Marvin Test Solutions' new GX3756 3U board is a flexible instrument.

David Maliniak

Related To: Marvin Test Solutions

With 56 channels of TTL logic-compatible I/O, Marvin Test Solutions’ GX3756 Series digital-I/O instrument proves a versatile tool for military, aerospace, and industrial applications. The 56 channels come segmented into fourteen 4-channel groups in a high-performance 3U PXI hybrid slot-compatible instrument. Each I/O channel can be accessed utilizing read/write register commands and each group of four TTL outputs can be either enabled or tri-stated. The GX3756 comprises the GX3700 FPGA carrier card with Altera’s Stratix III FPGA and an I/O daughter card. The FPGA may be modified by customers to create customer-specific functions.

Four of the 56 TTL outputs can be configured to deliver 30-bit, 1-kHz serial data streams, while connector/cable identification is supported with three connector ID bits, further enhancing the utility of this card. TTL-input overvoltage protection ensures safe, reliable operation, and output state monitoring with the readback function provides the ability to verify programmed operation. A ruggedized, extended-temperature version is available for deployment of test systems in harsh environments.

The GX3756 Series is supplied with GxFPGA, a software package that includes a virtual instrument panel, and a Windows 32/64-bit DLL driver and documentation. Interface files are provided to support access to programming tools and languages such as ATEasy, LabVIEW, C/C++, Microsoft C#, and Visual Basic.Net. A Linux driver is also provided with the GtLinux software package.

Marvin Test Solutions, www.marvintest.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.