Mercury Microelectronics SHIPs Out with RF SiPs

May 24, 2022

Tom Smelker, VP & GM of Mercury Microelectronics, discusses the company's new RFS1140 RF system-in-package as well as its broader involvement with the U.S. Navy's State-of-the-art Heterogeneous Integrated Packaging (SHIP) project.

David Maliniak

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Microwaves & RF

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The U.S. Department of Defense is always looking for an edge, ways to get advanced electronic-warfare capabilities into field-ready systems in less time, for less money, and with improved performance compared with previous generations. One of the mechanisms for accomplishing these goals is the State-of-the-art Heterogeneous Integrated Packaging prototype project. The idea is to bring commercial industry knowledge and capabilities to bear on the complex process of bringing concepts into reality.

In 2019, Mercury Systems began investing heavily in its microelectronics business, and one of the first fruits of that investment is the RFS1140 RF system-in-package (RF SiP), a device aimed squarely at the compute-intensive task of processing sensor inputs at the edge.

We've covered Mercury's involvement in the SHIP project, but here to discuss it in more depth is Tom Smelker, VP & GM of Mercury Microelectronics. In this video, Tom covers how and why Mercury has engaged with SHIP, what the RFS1140 brings to the table, and a bit about Mercury's future plans for its microelectronics business.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.