AI for Wireless from MathWorks' Perspective

April 10, 2023

MathWorks' Houman Zarrinkoub discusses how artificial intelligence is transforming wireless-network design and operation.

David Maliniak

Related To: Microwaves & RF

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AI has brought the sophistication necessary for modern wireless applications to run effectively, from autonomous vehicles to optimized wireless links, as it tackles the non-linearity introduced by new and competing use cases. As the number and scope of devices connected to networks expands, so too will the role of AI in wireless. Knowing the benefits and applications of AI in wireless systems, as well as the best practices necessary for optimal implementation, will be key for the future success of the technology.

In this TechXchange Talk video, Houman Zarrinkoub, principal wireless product manager at MathWorks, discusses how the complexity of modern wireless systems has necessitated the implementation of AI technologies. 5G, the evolution of wireless technology and the introduction of Industry 4.0, and the rapid pace of digital transformation has forced engineers to think beyond traditional rules-based approaches as networks become harder to manage. Many are turning to AI as the go-to solution to govern the increasing complexity of these systems.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.