In 2023, Things are Looking Up for Matter with Thread

Jan. 12, 2023

With all of the buzz surrounding Matter and its import for the IoT, we talked with the Thread Group about its outlook for 2023 in terms of Matter's market acceptance and technology developments with Thread itself.

David Maliniak

Related To: Microwaves & RF

This video is part of TechXchange Talks.

In the consumer electronics world, one of the hottest technologies around is Matter. It's a protocol that offers the promise of true interoperability amongst smart-home devices, no matter what branding they carry, and across the various smart-home control platforms like Google Nest Hub or Amazon Echo. A critical element underlying Matter is Thread, itself a wireless networking protocol that defines how devices connect with each other in a mesh networking scheme.

In this video, two representatives of the Thread Group (Jonathan Hui, VP of technology and Sujata Neidig, VP of Marketing) discuss what 2023 holds for Thread, Matter, their market acceptance, and technology developments in the smart-home ecosystem.

Check out more TechXchange Talks videos.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.