0122 Mw Infineon Smart Home Ces Promo 61d4eb73c541d

Bluetooth LE SoC Suits IoT, Smart Home, and Industrial Use Cases

Jan. 5, 2022

Infineon’s latest AIROC Bluetooth SoC combines low power consumption and high performance in a range of BLE connectivity applications.

David Maliniak

Related To: Microwaves & RF

Check out our CES 2022 coverage.

The Overview

Infineon Technologies is launching the AIROC CYW20829 Bluetooth LE system on chip (SoC), a Bluetooth 5.3 core spec-compliant device for IoT, smart home, and industrial applications. Combining low power and high performance, the SoC supports the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls, and any other Bluetooth LE-connected IoT application.

Who Needs It & Why?

Designers of smart, connected devices will find great utility in the device’s combination of low power consumption and high performance. It’s designed with efficient peripheral design, low-leakage silicon with scalable and efficient MIPS, and a low-power Bluetooth radio. The result, says Infineon, is reliable, robust connections for a quality end-product user experience.

Under the Hood

The new device integrates a power amplifier with 10 dBm of transmit output power and has receive sensitivity of -98.5 dBm for LE and -106 dBm for LE-LR, providing 125-kb/s data transfer rates for the best link budget in the AIROC Bluetooth portfolio. The best-in-class RF performance offers reliable, robust connectivity without compromising low power—making the CYW20829 suitable for a wide range of applications in smart home, smart building, medical, industrial, mesh, and human interface devices (such as a keyboard, mouse, remote control, and so on).

The CYW20829 is the first Infineon AIROC Bluetooth SoC to use the ARM Cortex M33. The Bluetooth LE subsystem is architected for low current consumption with a highly optimized radio and an ARM Cortex M33 core focused as the Bluetooth controller. A second ARM Cortex M33 with a floating-point unit is dedicated for customer applications and can be clocked up to 96 MHz to provide high performance compute at low power.

The application sub-system is highly integrated with configurable serial communication blocks that can be turned into UART/I²C/SPI as needed, multiple timer/counter pulse-width modulators, I²S, PDM, CAN, and LIN interfaces. Security is built into the platform architecture with a ROM-based root of trust, a TRNG, eFuse for custom keys, and cryptography acceleration. For added flexibility, AIROC CYW20829 also supports XIP from external flash as well as encryption on the fly for content on the flash.

The AIROC CYW20829 is supported by ModusToolbox, a collection of easy-to-use software and tools enabling rapid development of Bluetooth-enabled IoT solutions.

Availability

The AIROC CYW20829 Bluetooth LE SoC is currently sampling to select customers.

Check out our CES 2022 coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.