Products of the Week: February 14, 2022

Feb. 14, 2022

Happy Valentine's Day! We hope you'll love the selection of new products featured here as much as we do.

At the heart of our mission here at Microwaves & RF is to regularly feature Media Galleries of some of the most interesting new product announcements of the recent past. It's our hope that products such as these will inspire you to create your own new offerings.

In this Gallery, the products we feature include:

A compact add-on board that brings IoT connectivity to a myriad of applications
A USB camera that offers dual-stream support
Rugged wire-to-wire connectors with IP68 waterproofing
A tool kit for coaxial-cable installations
Surface-mount ceramic chip inductors that can handle up to 3400 mA DC.

Here are some more recent Products of the Week Galleries:

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.