Texas Instruments
TI's AWR2544LOPEVM evaluation module

Kit Aids Development for Satellite Radar Sensor Chip

Nov. 5, 2024
As automotive electronics move to satellite architectures, a radar sensor and associated development kit help engineers build smarter ADAS systems.

Things move fast in the wireless world, and the realm of automotive advanced driver-assistance system (ADAS) electronics is no exception. The typical electronic system architecture in today’s vehicles is an edge architecture. But edge architectures are giving way to satellite architectures, whereby radar sensors output semi-processed data to a central processor for ADAS decision-making using sensor-fusion algorithms. This approach takes advantage of 360-degree sensor coverage for greater levels of vehicle safety.

One device that fits into this category is Texas Instruments’ AWR2544, an FMCW satellite radar-on-chip sensor that operates from 76 to 81 GHz. It’s said to be the industry’s first device with launch-on-package (LOP) technology. LOP helps reduce sensor size by up to 30% by mounting a 3D waveguide antenna on the opposite side of the PCB.

Not only that, but LOP technology boosts sensor ranges to more than 200 meters. The result is increased ADAS intelligence for higher levels of vehicle autonomy due to smarter decision making from farther away.

TI also offers its AWR2544LOPEVM, an easy-to-use evaluation board for the radar-sensor chip. It provides direct connectivity to TI’s DCA1000EVM evaluation module for real-time data capture and streaming. The AWR2544LOPEVM kit contains all necessary elements to develop software for the sensor’s on-chip Arm Cortex-R5F controller and hardware accelerator. In addition, there's on-board emulation for programming and debugging as well as buttons and LEDs to quickly integrate a basic UI.

The AWR2544LOPEVM evaluation module is available from TI for $549, while the DCA1000EVM real-time data-capture adapter sells for $599 and can be had from TI or its distribution channels.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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