Qorvo Unveils the World's Smallest 2- to 18-GHz, 10-W Front-End Module

June 7, 2023

The highly integrated FEM brings high performance in terms of power, power-added efficiency, and bandwidth to defense-related applications.

David Maliniak

Related To: Microwaves & RF

This article is part of our IMS 2023 coverage.

Visit Qorvo in IMS Booth 935 for a look at what it claims is the world’s first front-end power module covering the 2- to 18-GHz frequency range. The QPF0219 is a 10-W multichip front-end module (FEM) that integrates a transmit/receive (T/R) switch, a limiter, a low-noise amplifier, and a power amplifier, making it highly suited for electronic warfare, multifunction wideband arrays, radar, and communications applications.

Available in an 8- × 8-mm air-cavity QFN package, the QPF0219 delivers exceptional performance in a highly compact footprint. The multi-die QPF0219 offers the optimal semiconductor technology for each functional block to maximize performance in challenging radar applications. The power amplifier and T/R switch use GaN-on-SiC technology, while the limiter and LNA leverage GaAs technology. Transmit power is 10 W saturated with 20% PAE with large-signal gain of 13 dB. The receiver noise figure is 4 dB, small signal gain comes in at 14 dB, and the P1dB is 21 dBm.

QPF0219 samples and production devices are available from Qorvo and authorized distributors.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.