1021 Mw Mega Phase Mega8 Multiport Connectors Promo 616713aa522fc

Multi-Port Connector System Boosts RF Performance Level

Oct. 13, 2021

Thanks to spring-loaded contacts, MegaPhase’s Mega8 multiport connectors withstand the harsh conditions of avionics duty.

David Maliniak

Related To: Microwaves & RF

The Overview

MegaPhase’s Mega8 multi-port connector system is said to deliver exceptional performance in both fixed- and rotary-winged airframes with positive mating under extreme vibration conditions.

Who Needs It and Why?

Connectors for avionics applications require maximum ruggedness to endure the harsh conditions they’ll encounter in flight. MegaPhase’s Mega8 devices meet the requirements of MIL-T-81490 and MIL-C-87104, ensuring that they’ll withstand the rigors of avionics duty.

Under the Hood

Mega8 multi-port connectors stay mated thanks to spring-loaded interfaces that won’t unmate in harsh conditions. The connectors, which are described as an alternative to Times Microwave’s M8 connectors, offer individually sealed housings and cable assemblies. They provide simple front release of individual cable assemblies as well as a single jack-screw mating feature, and the housings accept a wide variety of cable assembly types including flexible, semi-rigid HyperFlex up to 0.480” in diameter. Housings are keyed to allow for multiple housings on a single enclosure. Two standard plating options are available: chemical film and EN-PTFE.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.