Naprotek Adds RF Products, Manufacturing Capabilities

June 14, 2022

By dint of a pair of recent acquisitions, Naprotek will display expanded services and a line of RF products at IMS2022.

This article is part of our IMS2022 coverage.

At its IMS2022 Booth #12030, Naprotek will display the fruits of its recent acquisitions of SemiGen and NexLogic in the form of RF products and expanded manufacturing services. The RF product lines include a mix of commercial-off-the-shelf (COTS) components, complemented with a series of derivative and custom parts.

The manufacturing elements include both RF/microwave assembly (MicroE) and surface-mount technologies for modules, printed-circuit-board assemblies, sub-assemblies, and box-build integration. These complement the company’s ability to support integrated microwave assemblies (IMAs), multi-chip modules (MCMs) and chip-on-board (COB), with mixed technology solutions from assembly and test, through environmental screening.

For more information, visit the company website.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.