Demos Underscore Importance of Phase Stability Over Temperature in Cable Assemblies

June 16, 2022

At IMS2022, Junkosha will showcase the qualities of ePTFE-tape-wrapped cable assemblies in environments involving temperature deviation.

David Maliniak

Related To: Microwaves & RF

This article is part of our IMS2022 coverage.

In its IMS2022 Booth 10017, Junkosha will showcase its new MWX7 Series cable assemblies, in particular their applicability to environments with significant temperature gradients. As increasingly complex 5G and 6G systems are developed, requiring higher frequency bands, so the need for cables with the highest phase stability against temperature become critical.

One of the challenges microwave engineers face is that of maintaining phase stability across multiple channels from antennas and sensors in such environments. More complex modulation schemes operating at higher frequencies in next generation 5G and 6G systems will only exasperate this situation.

Junkosha’s MWX7 Series Assemblies provide phase stability in multipurpose applications delivering reliable electrical performance, especially in phase and amplitude stability against temperature, to support repeatable measurement results across applications like phased array radars, 5G antennas and automatic test environments. The new ePTFE tape wrapped cable not only offers reduced phase and amplitude drift due to mechanical fluctuations, but it also promises consistent performance in both inter- and intra-batch quality.

For more information, visit the company website.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.