RF Connectors, Adapters Offer Quantum-Computing-Friendly Attributes

May 30, 2023

Quantum computing requires particular qualities in interconnects. Connectronics can modify its products to fit the bill.

David Maliniak

Related To: Microwaves & RF

This article is part of our IMS 2023 coverage.

The age of quantum computing is upon us, and when it comes to interconnects, quantum technology imposes certain requirements. In booth #515 at IMS 2023, Connectronics will showcase its RF connectors and adapters designed for quantum computing. The company can modify its extensive product line of 6,000 RF connectors to feature nonmagnetic and cryogenic attributes critical to quantum-computing applications.

These high-frequency, coaxial RF connectors are U.S.-manufactured with base material and plating finish combinations that minimize magnetic signature. Connectronics delivers connectivity solutions, ensuring minimal interference with quantum computing’s applied magnetic fields. A complete range of RF connectors can be produced in large and small quantities, including unique and hard-to-find connectors, and with flexible delivery options.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.