Premier Magnetics' PM-CMCX5 Series chokes offer versatility and high mechanical stability..

Chokes Build Differential- and Common-Mode Attenuation into Single Device

March 28, 2025

Premier Magnetics’s CM Guard Series chokes employ integrated magnetics for exceptional electrical performance; innovative Snap-In mounting secures the component to the PCB for greater stability.

David Maliniak

Related To: Microwaves & RF

To launch its new CM Guard Series of chokes, Premier Magnetics rolled out the PM-CMCX5 Series as the initial offering. The CM Guard Series implements integrated magnetics technology to build common-mode (CM) and differential-mode (DM) attenuation into a single device.

Features include strong 5-kV winding-to-winding insulation, a wide operating temperature range of –60 to 155°C, and low-capacitive coupling to the core. High mechanical stability comes by way of the company’s Snap-In technology to secure parts to the printed circuit board (PCB) without the use of epoxy during the assembly process.

^{>>Check out more of our}^{APEC 2025 coverage}

67b4ae5e16e2ce1f53c2b969promo_id_248687706__darryl

Power

APEC 2025 Coverage

Here's our ongoing coverage of the latest power technologies from APEC 2025.

Within the PM-CMCX5 Series are 16 models that offer a selection of spread or compressed windings and common-mode choke inductances from 0.5 to 30 mH. On the series datasheet is a part-number chart providing details on differential-mode inductances, typical current to cause a temperature rise of 70°C (IDC), DC resistance (DCR), and self-resonant frequency (SRF).

Because they provide both CM and DM attenuation, the CM Guard Series devices can reduce component counts in filter assemblies. In addition, the company’s Snap-In technology helps simplify and quicken product assembly by eliminating the need for epoxies. Future releases in the series will deliver higher DM inductances, higher temperature stability, and reduced size.

Prices for the PM-CMCX5 Series chokes range from $1.50 to $2.45 in OEM quantities; samples will be available for shipment in the second quarter of 2025.

Learn more about passive components

Passive components

Technology Transforms Passive Components

A new approach to fabricating passive circuit elements delivers compact, consistent, and reliable components through microwave frequencies.

Components

In Praise of the Basics: Passives, Discretes, Magnetics, Wires, and Packaging

No matter how sophisticated the software and how fast and powerful the logic, without the rest of the components, wiring, and packaging, nothing would work.

TechXchange

Magnetics: Transformers & Inductors

Magnetic components are often overlooked, yet are critical to the performance of your power circuitry.

Components

RF Components Form the Backbone of the Wireless Infrastructure

The incredibly complex and crowded spectrum would be unmanageable without the RF devices and components that populate the circuit boards in systems supporting its functionality...

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

Chokes Build Differential- and Common-Mode Attenuation into Single Device