Anokiwave Brings Next-Gen Beamforming ICs to IMS2022

June 17, 2022

With a plethora of beamforming ICs and development kits, Anokiwave looks to provide the underpinnings for next-generation antenna systems.

David Maliniak

Related To: Microwaves & RF

This article is part of our IMS2022 coverage.

In IMS2022’s Booth 11022, Anokiwave will display its latest Gen-4 multi-band silicon IC family, including silicon beamformer ICs as well as what’s termed the industry’s first single-chip dual channel IF up/down converter with a fully integrated LO synthesizer. The IC family enables greener, lower cost, and smaller form-factor mmWave 5G radios, for every 3GPP FR2 band. Anokiwave will also display Antenna Innovator Kits with new Gen-4 ICs, which demonstrate to customers how to realize the best performance of the ICs.

Complementing the mmWave 5G family is a full portfolio of SATCOM Ku and K/Ka-band beamformer ICs with a rich digital core that simplify active antenna designs. The company’s SATCOM portfolio enables ubiquitous global SATCOM connectivity with cost and performance improvements that make flat-panel SATCOM arrays a commercial reality.

For more information, visit the product webpage.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.