Knowles Presents High-Performance Audio Solutions at CES 2023

Jan. 17, 2023

Vibration sensors and TWS headsets lend themselves to consumer and aerospace applications.

Check out more of our CES 2023 coverage.

In the Knowles suite at CES 2023, Senior Apps Engineer Nikolay Skoborodnikov gives Senior Editor David Maliniak a look at several innovative Knowles product launches:

The V2S200D voice vibration sensor delivers clear voice-call quality in noisy environments. It isolates the low-frequency vibrations of the body and filters out, for example, wind noise, and then blends the high- and low-frequency captures to provide superior intelligibility, if not a high-fidelity rendering.
The Titan (digital) and Falcon (analog) microphones for true wireless stereo (TWS) headsets offer improved ambient noise cancellation (ANC) and transparency-mode functionality by removing some of the high-frequency hiss that often plagues such headsets.
The Robin (analog) and Cornell II (digital) microphones provide the highest-quality audio recording fidelity on consumer devices. Here, we're talking about the difference between 10% and 1% total harmonic distortion (THD).
A demonstration of a smart washing-machine control panel fitted with voice control incorporates Knowles' AISonic audio edge processor and SiSonic microphone array. Implementation on a Raspberry Pi means easy integration for OEMs.

For more CES 2023 news, information, and videos, CLICK HERE.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.