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RF-over-Fiber Links Modernize Orange’s Teleport

April 20, 2021

The French telecom giant installs ViaLite’s C-band RF-over-fiber links as part of an ongoing program to upgrade the Bercenay-en-Othe teleport.

David Maliniak

Related To: Microwaves & RF

In 2018, the French telecom giant Orange’s teleport at Bercenay-en-Othe celebrated 40 years of serving as a gateway from satellites to the wired terrestrial IP network and vice versa. Thus, as part of an ongoing effort to improve and modernize the teleport facility, ViaLite has deployed its C-band RF-over-fiber links for both uplink and downlink paths (Figure 1).

ViaLite collaborated with its French distributor Eurosatcom to help upgrade the teleport operations. The RF-over-fiber links provide high dynamic range and contribute full integration with the monitoring and control-chassis system, which includes dual redundancy.

1. ViaLite's C-band RF-over-fiber links enable the Orange teleport to eschew deployment of downconverters at the antenna end.

The C-Band modules represent a higher-frequency up/downlink solution for any C-band antennas installed at the facility, which overall has more than 30 antennas onsite. The RF-over-fiber links also remove the need for any downconverters to be deployed at the antenna end. By installing the C-band links at the teleport, Orange gains the opportunity to cover up to three different bands: UHF, L-band HTS, and C-band, while supporting high-throughput satellite operations.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.