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IMS 2021 Brims with Technical Fare

June 1, 2021
This month, IMS returns as a live event, in addition to a having virtual version. Though the format changes up from IMS shows from the past, prepare for the same massive amount of technical programs and product announcements it has on tap.

Check out our full coverage of IMS 2021.

Every business and industry under the sun has its conferences and exhibitions. My older brother, now retired, owned and operated a carpet and upholstery cleaning business for decades, and every couple of years he’d take a day or two off and hit the industry’s convention. He’d come back having learned a ton about things like stain-removal technology and how to properly apply fabric protectants like Scotchgard. It was mundane, sure, but it was good, practical information that made him better at his work.

When RF and microwave engineers think “conference and exhibition,” the first—and maybe only—one that comes to mind is the International Microwave Symposium (IMS). IMS is happening this month, with a live event taking place in Atlanta (June 7-10) and a virtual version (June 20-25). Last year, of course, was unlike any other in recent memory, and the live event obviously didn’t happen, with only a virtual IMS occurring in September. The organizers went with the split approach for this year, because some exhibitors and attendees remain understandably wary of the risks of travel and large public gatherings.

Just like at a carpet cleaners’ convention, you can learn an awful lot at IMS. If you don’t, it won’t be because the opportunity isn’t there. Both the live and virtual events have tremendous technical programs this year. In Atlanta, the program kicks off with traditional plenary keynotes by the chief technology officers of Honeywell and Texas Instruments. There’s also a pair of invited lectures, one on software-defined radio and the other covering the unfolding commercialization of terahertz technology, once solidly the domain of researchers and scientists. That’s changing quickly.

The slate of technical sessions offered at both the live and virtual events is exciting. IMS has mobile apps for both IOS and Android—by now, you can likely download the technical content of sessions in which you registered. Sessions cover everything from front-end circuit building blocks to new array-based wireless systems to physical-layer security, the latter being of great concern these days.

Both portions of IMS also will feature what’s being called Microwave Application Seminars, or MicroApps. These 15-minute sponsored presentations take place right on the exhibition floor in a theatre setup. Whereas the traditional technical sessions lean toward the theoretical and academic side, MicroApps promise to be very practical in nature. You can hear about all kinds of test-and-measurement topics, design techniques, and production-related information. It’s the sort of thing you can just wander over to when you have a few minutes, and who knows, you might pick up something that’s immediately useful or sparks an idea. Hey, it’s got to be better than hearing about stain removers, right?

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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