Empower RF Systems
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High-Power Pulsed Amplifier Module Serves X-band Radar Requirements

June 16, 2022
Empower RF’s latest pulsed amplifier module provides over 250 W peak output with pulse widths up to 500 µs.

This article is part of our IMS2022 coverage.

At IMS2022, visit Empower RF’s Booth 9020 to learn about its Model 1222 high-performance X-band pulsed module designed for new radar applications in which portability and extended range are key requirements.  Operating from 9 to 10 GHz, Empower’s 1222 provides over 250 W peak output power in a compact pulse module featuring pulse widths up to 500 µs and 20% duty cycles.

The 1222 module utilizes 48-V GaN-on-SiC devices and is lightweight, highly reliable, and rugged. It takes less than 250 ns to enable or disable, and gain settings can be done in analog or digital fashion

Built-in protections with alarm include overtemperature, overvoltage, reverse polarity, overcurrent, temperature reporting, and current reporting.

For more information, visit the company website.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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