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Power: Overlook It at Your Own Peril

March 20, 2023
Often an afterthought in board- and system-level design, power can literally trip you up. Fortunately, there are resources for learning like this week’s APEC in Orlando.

Check out our APEC 2023 digital magazine for more show coverage.

When I was a much younger editor, I covered segments of the OEM electronics industry that were a lot less exotic than the wireless world. We’re talking things like components and packaging, interconnects, passives, wire and cable—real nuts-and-bolts stuff. Sometimes, even, actual nuts and bolts or other fasteners.

Exotic to me, back in the day, were things like flip chips and ball-grid arrays and concepts related to 3D packaging. And, not infrequently, I’d find myself talking to purveyors of items like dc-dc converters or other board-level, power-related products. Such elements of system design were almost as ho-hum to me as toroids.

A frequent line of discussion with power-supply people was how often power was overlooked by system designers. I’d hear cautionary, and possibly apocryphal, anecdotes about designers who’d approach power-supply apps engineers with serious last-minute problems: “I needed X watts of output on this bus, but the board layout left very little space on the board for the supply. I’m really stuck. Can you possibly come up with a custom device that will do the job?”

The point of these tales was that in any context, overlooking board- or system-level power requirements is a critical mistake. All too often, though, power was one of the last things considered. A power supply that’s not up to the task of responding to dynamic load changes can wreak untold havoc with digital logic, causing false switching and/or timing problems. Thus, it behooves designers to always have power in mind during the course of a project, rather than treat it as an afterthought.

Fortunately, great resources are available to help designers learn about the latest developments in power electronics. One of them is the annual Applied Power Electronics Conference (APEC), happening this week at the Orange County Convention Center in Orlando (March 19-23, 2023). Power-electronics professionals will converge on APEC for a smorgasbord of workshops, technical sessions, seminars, and social events that focus on one thing and one thing only: power.

At APEC, you will find professional education seminars that delve into practical aspects of complex power-electronics topics, adding in theory to further designers’ education. There’s a full slate of technical sessions with peer-reviewed presentations covering highly innovative technical solutions. At the exhibitor seminars, industry vendors will update attendees on new products or initiatives in the power-electronics arena.

And, of course, you can’t miss the exposition itself, with hundreds of vendors serving the power-electronics industry showing off the latest and greatest in technology and solutions. They’re eager and waiting to help you solve all of your power-related problems, including that space on a PCB that’s too small for so many watts of output.

We’ll be at APEC, too, canvassing the show floor to catch up with what’s new in the power-electronics space. You can find our existing and continuing coverage of the event in a special digital magazine on our website.

Check out our APEC 2023 digital magazine for more show coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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