What's New at IMS 2021: Live Day 3

June 9, 2021

It's the third day of the IMS live event in Atlanta. Come along as we continue our coverage of exciting new products debuting on the exhibition's bustling show floor.

David Maliniak

Related To: Microwaves & RF

Check out our full coverage of IMS 2021.

By the third day of a busy technical conference and exhibition like the International Microwave Symposium (IMS), attendees, exhibitors, and speakers alike are beginning to wear down a bit. Three days of "show (hot) dogs" will do that to you. But IMS is the RF/microwave industry's premier event, one that is anticipated nearly from the day the last one ended. So, we fight through the fatigue and press on to wade through another aisle of booths, hear another keynote address or technical presentation, or take in another workshop or networking event.

In this Media Gallery, we present some of the exciting new products making their debuts at the live exposition.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.