R&S Hosts RF Design Challenge; Demos Sub-THz/6G Front End

June 1, 2023

Are you an RF genius? Find out at Rohde & Schwarz’s IMS 2023 booth and catch demos of numerous test products.

This article is part of our IMS 2023 coverage.

At IMS 2023 Booth 735, Rohde & Schwarz will showcase multiple live demos of cutting-edge test and measurement developments. IMS attendees can also participate in the interactive "Are you a genius?" RF Design challenge, putting their knowledge to the test through a series of lab challenges that evaluate an attendee’s knowledge of S-parameters, EVM, high power, and baseband measurements.

In addition to the RF Design Challenge, Rohde & Schwarz will highlight multiple demonstrations at the company’s booth. These include the new 67-GHz noise-figure measurement capability that further enhances the R&S ZNA vector network analyzer for full characterization of amplifiers and converters.

On the road to 6G, revolutionary technologies demand new ways of testing for the next generation of wireless communication. Several highlights at the Rohde & Schwarz booth are the latest solutions for early sub-terahertz and 6G research applications. The R&S FE170ST external front ends (see image above) extend the frequency ranges not only of the company’s signal and spectrum analyzers, but also of its signal generators up to the D-band (110 to 170 GHz), enabling engineers to access the range they need to develop the next generation of mobile communications. In addition, demonstrations of both the R&S ZNA vector network analyzers and the R&S FSWP phase-noise analyzer will highlight 6G D-band system and component characterization.

Also on display is the R&S ATS1800C CATR-based, 5G/6G mmWave over-the-air (OTA) test chamber, which provides a suitable environment for testing antennas, modules, and devices from R&D to conformance. When equipped with the two side-chamber extensions, the chamber forms a 3D quiet zone, within which the test solution supports very-small-footprint RRM measurements, including multiple angles of arrival (AoA).

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.