672e469894ea7d32a8033fa9 70ghzbullseyesievalkit Version1

70-GHz SI Test Assembly System Now Has Eval Kit

Nov. 8, 2024

Samtec offers an SI test platform for evaluating its BE70A 70-GHz, Bulls Eye double-row test system.

Earlier this year, Samtec released its Bulls Eye high-performance test assemblies for frequencies as high as 90 GHz. The assemblies, which help shrink evaluation boards and trace lengths, serve test applications for SerDes characterization, clock/data recovery, mmWave radar, automated test equipment, and FR2 5G networks.

To aid engineers in evaluating the Bulls Eye assemblies, Samtec offers a 70-GHz Bulls Eye signal-integrity (SI) evaluation kit. It gives system designers, RF engineers, and SI engineers a means of testing the double-row Bulls Eye system to ensure its performance in their specific applications.

The 70-GHz Bulls Eye SI Evaluation Kit (REF-213864-01) is a single-PCB system with a compact form factor. Each PCB includes one BE70B (BE70B-J-S-2-04) compression interface that provides easy mating and eliminates soldering. Each kit comes with four BE70C (BE70C-S-185P-2-02-0305) Bulls Eye cable assemblies.

The board routes high-frequency referential signals (a total of eight) from the BE70A to precision RF compression-mount connectors. The kit delivers optimized SI performance thanks to the company’s Final Inch BOR PCB trace routing.

With the evaluation kit, users can perform time-domain measurements through direct connections to time-domain reflectometers or time-domain transmissions, or frequency-domain measurements through direction connection to vector network analyzers. It can be used with IC characterization kits, 112-Gb/s PAM4 transceiver development kits, and FPGA evaluation and development kits.

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David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.