The Snapdragon Ride Flex SoC, which is scheduled to start mass production in early 2024, is designed to support “mixed-criticality” workloads in the vehicle.
The ultra-compact multi-sensor module, which integrates TI’s CC2652R7 SimpleLink wireless MCU, aids real-time prediction of anomalies in machinery and equipment.
By validating the R&S CMP180 radio communications tester for Broadcom’s Wi-Fi 7 chipsets, the two companies have paved the way for OEMs and ODMs of wireless devices to ready their...