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67897a3bf36f2fc131025d76 Iot Dreamstime Andreidzemidzenka 149977116

LTE-M IoT Deployments Boosted by Module’s MNO Certifications

Jan. 17, 2025
Centered on a Sony chipset, Telit Cinterion’s ME310M1-W1 IoT module paves the way for global deployment opportunities for next-generation cellular LPWANs.

The Overview: Future-Proofed IIoT Deployments

Bolstered by certifications from two major U.S.-based mobile network operators (MNOs), Telit Cinterion’s (CES Booth 10363, North Hall) ME310M1-W1 IoT module provides not only comprehensive global band support, but also highly flexible embedded connectivity options. The LTE Category M1 and NB2 module offers future non-terrestrial-network connectivity and easy integration with mesh networks in a broad range of industrial IoT (IIoT) use cases. The MNO certifications enable IoT network builders to accomplish worldwide deployments immediately.

Who Needs It & Why: Flexible, Low-Power IIoT Connectivity

Design teams looking to implement IIoT networks enveloping such devices as smart utility meters, asset trackers, industrial sensors, or smart agriculture sensors will find value in the module’s flexible connectivity options. These include the company’s NExT global connectivity and eSIM provisioning, which simplify device deployment and subscription management throughout the project lifecycle.

>>Check out more of our CES 2025 coverage, and this TechXchange with similar articles and videos

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Under the Hood: Wi-Fi Scan and GNSS Support

Thanks to its support for multiple technologies and both licensed and unlicensed spectrum regions, the ME310M1-W1 IoT module opens the door to faster network development with lower power consumption, smaller node sizes, and compatibility with new and emerging use cases.

The ME310M1-W1 supports multiple location technologies, including Wi-Fi-scan and the Global Navigation Satellite System (GNSS). This gives designers greater flexibility when selecting technologies for both indoor and outdoor positioning applications, such as keeping tabs on medical equipment across a hospital campus.  

The device’s low power consumption brings longer service life to battery-powered IoT devices. In turn, it leads to smaller devices with extended battery life and eliminates the cost and trouble of periodic battery replacement. Also, due to the device’s short-range radio support, it’s easily integrated into mesh networks and provides seamless operation across multiple air-interface technologies.

Telit Cinterion has a roadmap for future compliance with features expected in 3GPP Releases 15, 16, and 17, such as IoT data communication over non-terrestrial networks (NTNs). As a result, users will be able to fall back onto satellite technology when cellular coverage is unavailable.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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