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Test and Analysis GUI Targets DDR PHYs

July 7, 2023

The test and analysis GUI from OPENEDGES, code-named PHY Vision, serves as a comprehensive cockpit for visualizing and optimizing the performance of the DDR PHY.

David Maliniak

Related To: Microwaves & RF

This article is part of our DAC 2023 coverage.

At DAC 2023, OPENEDGES Technology will be in Booth 1354 demonstrating a beta version of its PHY test and analysis software. In the live demo, the software will be connected to a 12-nm LPDDR54 test platform.

The newly developed test and analysis GUI, code-named PHY Vision, serves as a comprehensive cockpit for visualizing and optimizing the performance of the DDR PHY. It offers a range of training options to optimize data eye diagrams, including running READ/WRITE eye shmoos, and provides extensive controls to high-speed I/Os and analog circuits. PHY Vision also incorporates utility features to build firmware within its interface, making it easy for test engineers to select firmware versions to load onto the system to perform characterization tests, bit-error-rate tests, eye shmoos, and performance tuning.

The PHY Vision test and analysis interface aims to streamline the workflow for test and validation engineers, providing important insights to the dynamic operation of OPENEDGES’ DDR PHYs.

For more information, visit the company's website

For more DAC 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.