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electronica 2024 Wrap-Up

Nov. 12, 2024
Check out our coverage of technology and products at electronica 2024.

The electronica 2024 trade show, held in Munich, Germany, was once again one of the largest gatherings of electronic technology and product vendors in the world. With the show now in the rearview mirror, our editors who covered it, including Editor-at-Large, Alix Paultre, offer up some of the product highlights.  

New Technology

This section highlights some of the new announcements that stand out. 

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Embedded

AI-Enabled RISC-V Cores Target ASIL B Automotive Applications @ electronicdesign.com

The MIPS P8700 RISC-V core, which implements a RISC-V ISA, aims at ASIL B and ISO 26262 functional safety.
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Wireless

Virtual Antenna Supports Multiple Standards

Ignion's virtual antenna technology, featuring a small footprint, supports a variety of standards.
onsemi
onsemi_wurth
Power

Collaboration Advances High-Accuracy Virtual Design of Power Apps @ electronicdesign.com

A power-loss model generator was updated with passive components to more accurately model designs and accelerate time-to-market.
Renesas (generated with AI)
renesasnidecfig1_promo
Automotive

“8-in-1” Integration Proof of Concept Targets EV E-Axles @ electronicdesign.com

Renesas, in collaboration with Nidec, developed the first “8-in-1” proof of concept for E-Axle systems that will help simplify electric-vehicle design. It controls eight functions...
NeoCortec
NeoCortec ultra-low-power bidirectional wireless mesh network modules.
Wireless

Scalable LoRa Wireless Network Handles Noisy Environments

NeoCortec's NeoMesh wireless network uses LoRa modulation to offer low power operation, scalability, and noise immunity.

New Products

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Embedded

Multicore Micro Targets Software-Defined Vehicle Tasks @ electronicdesign.com

Ignion's virtual antenna technology, featuring a small footprint, supports a variety of standards.
Renesas
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Analog

Renesas Introduces AnalogPAK Mixed-Signal Baby-FPGAs @ electronicdesign.com

Four new members were added to the AnalogPAK programmable mixed-signal IC product family: the SLG47011, SLG47001, SLG47003, and automotive-grade SLG47004-A.
Power Integrations
power_integrations_promo1920x1080
Power

GaN Process Brings SiC-Level Efficiency to 1,700-V Multi-Output Switcher @ electronicdesigncom

Power Integrations’ gallium-nitride power-conversion devices rated for 1,700 V marks yet another incursion on markets that, until now, were best served by products fabricated ...
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Smart home wireless connectivity
Wireless

Tri-Radio IoT Module Offers Broad Wireless Compatibility

The u-blox MAYA-W4 combines Wi-Fi 6, Bluetooth LE 5.4, and 802.15.4 for reliable, ubiquitous, and secure connectivity in the IoT ecosystem.
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Components

Hyperfast Rectifiers Reduce Switching Losses

A new family of Hyperfast rectifiers lower switching losses while reducing parasitic capacitance and recovery time.

There were a lot of new products announced and shown at electronica. Here is a selection of some of the more notable announcements. 

New Development Kits

Texas Instruments
TI's AWR2544LOPEVM evaluation module
Sensors

Kit Aids Development for Satellite Radar Sensor Chip

As automotive electronics move to satellite architectures, a radar sensor and associated development kit help engineers build smarter ADAS systems.
Silicon Labs | IoT_Dreamstime_858526756
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IOT

Platform Props Up Prototyping with IoT SoCs for Energy-Harvesting Apps

Ride the “ambient IoT” wave with a kit for prototyping battery-less IoT devices that grab power from magnetic/electric fields, light, heat, kinetic energy, and sound.
Samtec | Generated by AI
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Test & Measurement

70-GHz SI Test Assembly System Now Has Eval Kit

Samtec offers an SI test platform for evaluating its BE70A 70-GHz, Bulls Eye double-row test system.
About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

About the Author

William G. Wong | Senior Content Director

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.>

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form. 

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

You can my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

About the Author

Alix Paultre | Editor-at-Large, Microwaves & RF

Alix is Editor-at-Large for Microwaves & RF

An Army veteran, Alix Paultre was a signals intelligence soldier on the East/West German border in the early ‘80s, and eventually wound up helping launch and run a publication on consumer electronics for the U.S. military stationed in Europe. Alix first began in this industry in 1998 at Electronic Products magazine, and since then has worked for a variety of publications, most recently as Editor-in-Chief of Power Systems Design.

Alix currently lives in Wiesbaden, Germany.

About the Author

Cabe Atwell

Engineer, Machinist, Maker, Writer. A graduate Electrical Engineer actively plying his expertise in the industry and at his company, Gunhead. When not designing/building, he creates a steady torrent of projects and content in the media world. Many of his projects and articles are online at element14 & SolidSmack, industry-focused work at EETimes & EDN, and offbeat articles at Make Magazine. Currently, you can find him hosting webinars and contributing to Penton’s Electronic Design and Machine Design.

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